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Led heat dissipation substrate


led heat dissipation substrate 46ft) Thermoelectric separation technology is based on the higher heat dissipation requirements of high power electronic products, which needs to meet two basic conditions: 1. How to judge whether a LED lamp is good or bad? A reasonable design of heat dissipation, make fine lamps, heat dissipation capacity and power corresponding Dec 09, 2019 · Aluminum substrate – The aluminum printed circuit boards offer good heat dissipation and heat transferring ability. These highly effective thermal interface materials contain special alumina, boron nitride, silica, aluminum nitride fillers or particles to improve device reliability and LED AL2O3 or AIN Heat-Dissipation Substrate made By thin Film Process,Flip Chip Substrate,Electrode & Electroless Plating Management Substrates. However, in this heat dissipation structure, the heat transmission speed of the aluminum substrate and the heat sink is slightly insufficient, because the two are fixed together. The problem of heat conduction and heat dissipation is an important part of the current lighting design. Rth Ag is the thermal  Chanzon 25pcs 1W 3W 5W LED Heat Sink (4 pin White) Aluminum Base Plate Board Substrate 20mm Star DIY Heatsink Cooling for RGB COB High Power LED These provide great heat dissipation, easy to read polarity markings. Nowadays, aluminum PCB applications are very wide which contributes to its high heat dissipation property. LED filament bulbs have many smaller, lower power LED chips than other types, avoiding the need for a heatsink, but they must still pay attention to thermal management; multiple heat dissipation paths are needed for reliable operation. 1um to 5mil Ceramic Metallized substrate Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED May 29, 2019 · For III‐nitride‐based devices, such as high‐brightness light‐emitting diodes (LEDs), the poor heat dissipation of the sapphire substrate is deleterious to the energy efficiency and restricts many of their applications. Product design optimized by  The application of metal substrate provides a new way to solve the heat dissipation of LED effectively. The Cu alloy films are then annealed at 600 and 730 °C, respectively, for 1 h without notable Cu oxide formation at the Cu-Ta The Difference Of Usage That Between The LED Corn Lamp and LED Bulb Lamp The design of LED bulb lamp takes heat dissipation into consideration. How to enhance the thermal dissipation performance is the most important key technology in related technological development [2]. Solar Cell The developments in the LED industry, as well as the high power/heat dissipation and electrical requirements, create the perfect intersection of market needs and materials science. The majority of LEDs used in vision applications are resin encapsulated single junction  Thermal management is of critical importance in LED lighting systems. 25, attached to sapphire substrate with Titan 1’s minimal heat dispersion results in a steady water temperature of the aquarium below. LED arrangement ( 10 ) comprising the following features: a substrate ( 22 ) with a heat sink interface ( 25 ) forming a lower surface thereof; an LED ( 91 ) at least partially fixed to the substrate and having a portion of the LED in contact with the heat sink pad; and wire connection pads ( 23-1 . DUPONT CIRCUIT CooLam thermal substrates dissipate heat in LED lighting applications which help enable LED manufacturers to offer longer life, greater reliability and better light quality from LED bulbs. The compact LED modules feature a particularly long service life and can also be controlled in zones, depending on where light is required on the substrate. what matters is the design of heat sink of lighting The LED heat-dissipating substrate mainly uses the heat-dissipating substrate material itself to have better thermal conductivity, and the heat source is led out from the LED die. Much attention is given to the heat sink, and less to the layers and barriers between the LED and the heat-dissipating surface. IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. 8mm silicon cavity Chips size: 24mil~35mil LED COB ceramic substrate Al2O3--3x3 for 9 die and 5~6Wt used Al2O3--5x5 for 25 die and 20 Wt used AlN--7x7 for 49 die and 50Wt used AlN 10x10 for 100 die and 100Wt used Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers &amp; produce The lifespan of LED emitters is reduced by high operating temperatures. If you use an LED with high efficacy (200+ lumens/watt), less electrical energy is dissipated as heat. This Cu-filled through (blind) hole acts as a superior heat-dissipation route, which directly and efficiently removes the heat generated by the light-emitting diode (LED) chip. China Si3n4 Ceramic Substrate Manufacturer, Silicon Nitrides for IGBT, Power Module Substrates, LED Substrate, Heat Dissipation Substrates, Find details about China Heat Sinks for High Power Electronics, High Power LED Substrate from Si3n4 Ceramic Substrate Manufacturer, Silicon Nitrides for IGBT, Power Module Substrates, LED Substrate, Heat Dissipation Substrates - Suzhou Hulsin Electronics Towards improving structural, surface, and thermal properties of MgO heat spreader, ZnO thin film was interstacked into MgO. Applications: Good Heat Dissipation,Motion Sensor For Dimming Warehouse Waterproof Led High Bay Lighting , Find Complete Details about Good Heat Dissipation,Motion Sensor For Dimming Warehouse Waterproof Led High Bay Lighting,Led High Bay Lighting,Warehouse Light,Waterproof Highbay from High Bay Lights Supplier or Manufacturer-Shenzhen Lite Science Electronics Co. - lead frame - soldering pad - substrate route is the principal heat dissipation route and has the greatest impact. Aluminum substrate is a unique metal based copper clad laminate, which has good thermal conductivity Jul 18, 2005 · Abstract: The heat dissipation in GaN devices grown on low thermal conductivity lithium gallate (LGO) substrates was investigated. The aluminum substrate is a unique metal-based copper clad laminate with good thermal conductivity, electrical insulation properties and machinability. Accordingly,  2 Aug 2011 LED Heat Dissipation and Lowering Thermal Resistance of LED Lighting Substrates. The films are Cu-alloy seed layers, fabricated by co-sputtering Cu and Ge in an Ar or N<SUB>2</SUB> atmosphere on either Ta/Al<SUB>2</SUB>O<SUB>3</SUB> or polyimide substrates. V-scoring is used consistently in printed circuit board assembly because it is a great cost saver and a highly efficient way to offer easy separation of parts Titan 1’s minimal heat dispersion results in a steady water temperature of the aquarium below. in the LED industry, as well as the high power/heat dissipation and  Heat dissipation/insulation substrate, which is a direct bonded copper (DBC) T. Junction temperature is a function of: ambient temperature; current through the LED; amount of heat sinking material in and around the LED 4 Results for "Heat dissipation" Alumina Substrates; Thick-Film Printed Substrates with Thinner Thickness one; Alumina Substrates for LED with High Reflectivity; This DCB and AMB Substrates for Power Modules is provided by using ceramic substrate made from material of aluminum oxides family, directly bonded by copper (Direct Copper Bonding = DCB), without joint layer which might generate thermal resistance. Group III-nitride light-emitting diodes (LEDs) fabricated on sapphire substrates typically suffer from insufficient heat dissipation, largely due to the low thermal conductivities (TCs) of their epitaxial layers and substrates. May 18, 2011 · Viking Tech steps into production of heat-dissipation ceramic substrates of HCPV (Jun 28, 2011) Ta-I shipping LED heat sink substrates to Everlight, Delta (Jun 17, 2011) Role of Substrate Choice on LED Packaging Author: Steve Lester Subject: resentation by Steve Lester of Toshiba to DOE SSL R&D Workshop, Tampa FL, January 28-30, 2014. This work investigates the heat dissipation  Request PDF | Heat dissipation design and analysis of high power LED array heat sink design with a fan on MCPCB substrate for a high-power LED array  19 Jun 2020 Thermal spreading resistance in the substrate (printed circuit board, PCB) Enhancement of heat dissipation of LED module with cupric-oxide  or copper substrate for heat dissipation (see illustration below). Alumina oxide is chosen for its strength, stiffness, and resistance to corrosion, as well as its electrical insulation and high thermal conductivity. LED plastic lantern light source LED high-power connection method: When connecting the LED plastic lantern high-power LED substrate to the heat sink, please ensure that the touch surfaces on both sides are flat to make the combination of the two touch surfaces more fit. Oct 31, 2019 · Measurement of Heat Dissipation and Thermal-Stability of Power Modules on DBC Substrates with Various Ceramics by SiC Micro-Heater Chip System and Ag Sinter Joining Dongjin Kim , 1, 2 Yasuyuki Yamamoto , 3 Shijo Nagao , 2, * Naoki Wakasugi , 4 Chuantong Chen , 2, * and Katsuaki Suganuma 2 LED Al2O3 thick film substrate ; LED AlN thin film heat-dissipation substrate ; Flip chip substrate ; The integration of the thin film,thick film,electrode plating and electroless plating processes: Application: 1. 2 Mar 11, 2011 · Viking Tech steps into production of heat-dissipation ceramic substrates of HCPV (Jun 28, 2011) Harvatek to set up joint venture in China (Jun 27, 2011) Viking Tech ships LED heat sink substrates Key Features. Abstract: Heat dissipation is an inevitable subject during the design of light emitting diode (LED) lighting, especially for museums and medical equipment. We are the leading company in the area of special circuit board manufacturing, heat dissipation PCB manufacturing, and LED lighting board design and produce. The size of power generally depends on the area of the street lamp head and its own heat dissipation. Therefore, from the description of LED heat dissipation methods, LED heat sink substrates can be subdivided into two major categories, namely, LED grain substrate and LED Display screen with aluminum cabinet and substrate, is good for heat-dissipation, waterproof is IP66-IP68, it can be used for most of outdoor areas. Jul 26, 2017 · Most of existing studies on thermal management of μ-ILEDs are for the system involving an isotropic substrate such that the heat dissipation in the substrate is uniform in the in-plane and off embedded LED was found to be reduced by about 17°C from the ∼62°C of the LED grown without the rGO buffer layer. surface roughness for high heat dissipation This paper presents a thermal analysis and experimental validation of natural convective heat transfer of a high-brightness light-emitting diode (LED) package assembly. (1) The non-uniform junction temperature of the module across the LED arrays and the uneven However, most aluminum substrate insulation layers have little thermal conductivity or even thermal conductivity, so that heat cannot be conducted from the LEDs to the heat sink (metal substrate), and the entire heat dissipation channel cannot be unblocked. Upon Jan 27, 2017 · To determine the effects of heat dissipation on the light output power, four types of LED arrays were considered: 1) array-1, with pixels on a flat polymer substrate and distance of 100 μ m; 2) array-2, with pixels on a flat polymer substrate and distance of 500 μ m; 3) array-3, with an array of pillars and distance of 500 μ m; 4) array-4 As the result of heat transfer, the balance between heat generation and heat dissipation was achieved, leading to equilibrium temperature of the LED chip. Temperature-dependent light output power and chip surface temperature measurements were also performed and the results are discussed. Copper alloy or CEM3 PCBs are used instead of the standard FR4 substrate due to their high heat dissipation property. In this study, we explore new Cu(Ge) and Cu(GeN<SUB>x</SUB>) films for LED heat dissipation. Our micro-grain material structure enables substrates which have a smooth surface with less voids, and high flexural strength and electrical insulation under high temperature environments. Thin &amp; Thick Film DPC /DBC Substrate OEM/ODM Ceramic metallized: gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)…others &amp; produce final circuit coating:0. 9 Dec 2019 The rapid development of the LED industry, especially in the high-power LED lighting, has raised concerns about heat dissipation. Adopting the thermoelectric separation structure: contact the lamp bead with zero thermal resistance, reduce the weakness of lamp bead light and extend the life of lamp bead to an Jul 25, 2019 · LED PCBs – The LED boards made of aluminum substrate since they require heat dissipation. Much attention is given to the heatsink, less to the layers and barriers between LED and the heat dissipating surface. Zur Verfügung gestellt von  LED power dissipation is modeled as a current source; thermal resistance is modeled as a resistor; and the ambient temperature is modeled as a voltage source. This layer offers electrical isolation with high thermal conductivity and bonds the base metal and circuit foil together. For instance, if the array comprises five thermal vias, the area normal to the heat source increases by a factor of five and hence the combined thermal resistance drops to 19. LED LAMP; KA03 LED LAMP; KA04 LED LAMP; KA05 LED LAMP; > VIKING > Heat -Dissipation Ceramic Substrate: Download: General Specification and Process Capability Aluminum Substrate with Superior Heat Dissipation SL Series Aluminum board excellent in thermal dissipation, an alternative to glass epoxy circuit boards. Extracting heat from the device using heat sinks and by operating LEDs in lower ambient temperatures enables higher light output and longer life of the device. With the popularity of LED lighting, customers' requirement has been more variable into the atmosphere through encapsulant and the lens or through the substrate. Whereas a metal substrate can create the risk of electric shock, a ceramic substrate is fully insulating. Due to its significantly higher thermal conductivity compared to FR4 technology, IMS is widely used in LED applications, especially high power LEDs . AIT has dedicated product developments with patented technologies that have proven to achieve the lowest thermal resistance from chip to heat-sink. In this paper, a novel substrate technology for an effective solution to two major problems that affect the heat dissipation performance has been introduced. Engineers ran transient conjugate thermal simulations and compared the results with the time histories of the thermocouples and dynamic IR thermal imaging. 20 Mar 2018 the heat dissipation [2] and hence the performance of the LEDs can be films coated on copper substrate through DC-RF coupled sputtering  dissipation of heat from the LED depends on these three modes. With ceramic it is feasible that the cooling Jul 07, 2017 · The primary mode of heat dissipation in LED is conduction through the substrate. MCPCB and aluminum ceramics substrate PCB board has good heat dissipation function, in the traditional LED heat dissipation on the use of the substrate, the Metal Core PCB (MCPCB) and radiating ceramic substrate using size is differ, MCPCB first used in the system circuit board, radiating ceramic An LED dissipates the electrical energy (V f x current) in two ways, heat and light. When a high power LED generates heat, the heat will first transfer through the top substrate to the thermoelectric units. In general, the COB LED holders are attached to the COB LEDs with screws; the tightening torque significantly impacts the adhesion strength. Mar 19, 2008 · Thermally conductive substrates dubbed OptoTherm OCB201 dissipate heat from visible-light-emitting diodes in solid-state lighting applications. LED power dissipation is modeled as a current source; thermal resistance is modeled to have a coefficient of thermal expansion mismatch with the silicon substrate of LED,  For substrate sealant (heat dissipation). Also because MCPCB conducts heat 100 times better than LED substrate, the heat can be effectively conducted from the LED substrate through the MCPCB substrate. Other manufacturers use standard prepreg as the dielectric layer, LED PCB Board Material - LED PCB raw material, LED bulb PCB raw material, LED strip PCB material. We always see the LED PCB light everywhere indoor and outdoor, like indoor and outdoor light, stage light, street light, automotive front light, stadiums and arenas light, industrial and Ceramic substrate is based on the electronic ceramic, with the membrane circuit element outside and the fitting element to form a support base for the sheet material. 3a and b, 9 TSVs are set in the silicon substrate on the bottom of each FC-LED chip and the temperature near TSV is higher than the far. This item Chanzon 25pcs 1W 3W 5W LED Heat Sink (2 pin Black) Aluminum Base Plate Panel PCB Circuit Board Substrate 20mm Star DIY Heatsink Cooling for COB High Power LED Chips Lamp Beads 1/3/5 Watt Chanzon 10 pcs High Power Led Chip 3W Purple Ultraviolet (UV 395nm / 400mA-500mA / DC 3V-3. metal core PCB) provide primary heat spreading, heat transfer to the heat sink, electrical connection to the driver, and mechanical mounting. Ceramic Substrate board – The ceramic substrate is made from high temperature co-fired alumina and aluminum nitride. Recently LedsUniverse has helped pushing this breakthrough even further by developing a channel or passageway between the junction and the heating sink, which allows the LEDs to be driven even @article{osti_1333225, title = {LED lamp incorporating remote phosphor with heat dissipation features}, author = {Tong, Tao and Letoquin, Ronan and Keller, Bernd and Tarsa, Eric}, abstractNote = {An LED lamp or bulb is disclosed that comprises a light source, a heat sink structure and a remote planar phosphor carrier having at least one conversion material. substrate 122 and a plurality of light-emitting diodes (LEDs) 124 disposed on the substrate 122   Most of the electricity in an LED becomes heat rather than light . An on-board driver IC allows software control of each LED in parameters such as 32 levels of brightness, internal multiplexing, and blanking. Since high power defined heat source, the goal of our simulations is to control the heat dissipation in the LED-chip and in the CCE, which insulated metal substrate (IMS). The better LED strips dissipate the heat, the better and more efficiency the aluminum profile will be. Jun 07, 2011 · A simplified model of an LED lighting assembly can be two elements in series with the total thermal resistance being the sum of that of each element. Herein, we used monocrystal silicon (c-Si) as the substrate and a charge injection Important Factors for an excellent Metallized Substrate. This work investigates the heat  These insulating heat dissipation substrates combine a pattern circuit with These substrates are used in a wide range of fields from laser diodes to LEDs for   Heat transfer is improved because TCLAD facilitates direct component to substrate leds surface mounted on thermal clad (TCLAD) insulated metal substrate  its influence on LED applications using thermal management at different system levels. LED T30 Tube Clear Product Feature * Precision German Engineering * Segula Constant Current Algorithm * 1%-100% Smooth Dimming * No Shadow, No Flickering * 100% Sapphire Substrate * High Lumen Efficiency * Excellent Heat Dissipation, Low Working Temperature Description Heat radiating grooves and vent holes are used for LED panels without heat sinks on the back. Advantages: The micro-spraying structure has high heat dissipation performance and the temperature distribution of the LED chip substrate is even. Long term, LED makers are working on innovative chip-packaging ideas that will Insulated Metal Substrate (IMS) The use of IMS circuit boards for simple single-layer circuits is a special but very effective method of heat dissipation for components across circuit boards. In this paper, we studied on the heat dissipation of high power LED in numerical simulation by the large eddy simulation numerical methods with the simulation software FDS, and studied the temperature distribution and heat pipe cooling respectively, etc. The aluminum base These hybrid LED filament bulbs can achieve maximum heat dissipation without a visible heat sink. For OLED displays, the non-uniform heat can cause uneven aging of the display, resulting in a noticeable color distortion. It shows that heat dissipation of the silicon substrate is enhanced because of the copper-filled TSV structure. Good heat dissipation can be achieved by increasing the adhesion strength between the COB LEDs and the housing. Light-emitting diodes (LEDs) suffer from heat problems that This is because the larger surface roughness of large-power LED heat dissipation block and PCB substrates and poor adhesive performance cause more pores on the sintering layer and larger interface resistance ; on the one hand, high-power LED heat dissipation block is made of aluminum which is easy to be oxidized, and the diffusion of silver There are many applications of LED lights PCB including traditional home appliances like LED Lights, Automobile lights, emergency lights, and solar-powered street LED lights, flashlights and LED torch. Heat Dissipation – The Reason Why LEDs are Being Driven to Higher Powers LED Technology has evolved a lot over the last couple of years to new lengths. To manage heat removal for LED lights, DuPont engineers used ANSYS CFD simulation to The heat dissipation of the. The substrate materials used in the LED package assembly were filled and doped using boron nitride (BN) filler. Heatsink comes with two flat sides for easier mounting to rails, two through holes for wire routing, and includes 4 screws for mounting the heatsink as well as 4 screws for mounting your COB/holders. Devices are made with a proprietary polyimide dielectric specially designed to be thermally conductive, dissipates The heat dissipation of the LED wafer is mainly related to the selection and process of the substrate and the circuit. The lamp shell 30 is fastened to the heat sink 10 by extending fasteners (not shown) through the holes 16 of the heat sink 10 into the holes 36 of the lamp shell 30 . Our results show that this diamond layer can effectively spread the heat and improve the temperature uniformity of thin-GaN LED chip, which enhances the heat dissipation efficiency down to the heat sink. This kind of design is capable to better translate thermal energy away from your design's components, therefore control your project's temperature. Large size aln Alumium nitride seramik substrate Heat dissipation is an inevitable subject during the design of light emitting diode (LED) lighting, especially for museums and medical equipment. More: 2010/09 [News] ICP released a patent of "Formation of tiny bores in LED heat-dissipated substrates". dissipated through to the metal core PCB (MC PCB) or other substrate used to mount the As an example, mounting a LED on a different heat dissipation rate. The heat dissipation problem of LED is the biggest headache for LED manufacturers, but aluminum substrates can be used. However, crucially, heat is produced within the LED device itself, due to the inefficiency of the semiconductor processes that generate light. Aluminium based materials, have received great attention in the electronic industry, especially in the heat sink substrate of light emitting diode (LED) lamps [1] [2] [3], due to their advantages Understand the relationship between heat dissipation and lamp luminous efficiency, life, and the way of heat dissipation, what is the way to judge whether a lamp is good or bad? 6. LED chips encapsulation directly on the copper surface, the heat directly conducted to the surface, and then out through the aluminum, it is the most ideal COB encapsulation cooling substrate materials. With the continuous increase of chip power density, VC has been widely used in the heat dissipation of CPU, NP, ASIC and other large power devices. LED chips are often placed on ceramic substrates made from Rubalit® alumina and Alunit® aluminum Find Details about LED substrate,ceramic pcb, ceramic substrate, thick film ceramic,thin film ceramic,ceramic metallized,LED COB substrate from Taiwan Other PCBs supplier-TENSKY INTERNATIONAL CO. Many of today's hottest and most promising fields depend on metallized Dec 10, 2012 · Based on the heat dissipation and considerations, at present on market LED grain base plate mainly ceramic base plate is given priority to, to line preparation of different methods can be roughly divided into: thick film ceramic substrates, low temperature co-firing multilayer ceramic, and film ceramic porcelain base plate three, in the One and two component thermally conductive epoxy and silicone compounds are employed for bonding heat sinks to electronics components and circuit boards to dissipate heat. As a certified professional manufacturer of metal substrate, our main object is to provide high quality product, quick delivery and enthusiasm service to our customers. Large size aln Alumium nitride seramik substrate Based on enhancing the polymer's thermal conductivity and distributing LED pixels, optimizing the substrate's micro-structure is an effective method to improve heat dissipation in bendable LED arrays. Each individual via may not seem to impact heat dissipation but collectively, with several vias under the LED’s thermal pad, the vias will affect the temperature. Aircraft-grade profile, Al substrate with high thermal conductivity, good heat dissipation, safe and reliable,silica gel protection process,6pcs LEDs,length of 0. Most power LED designs can use the Aluminum thin film available for enhanced reflectance; Available in alumina (Al 2 O 3) and aluminum nitride (AlN); AlN thermal conductivity: 170, 200 or 230W/mK; 0. High Thermal Dissipation Performance Metallized Ceramic Substrate For High Power Led Package , Find Complete Details about High Thermal Dissipation Performance Metallized Ceramic Substrate For High Power Led Package,Metallized Ceramic Substrate,High Thermal Dissipation Performance Metallized Ceramic Substrate,Metallized Ceramic Substrate For High Power Led Package from Electrical Ceramics Suitable for 6-10cm(2. China Si3n4 Ceramic Substrate Manufacturer, Silicon Nitrides for IGBT, Power Module Substrates, LED Substrate, Heat Dissipation Substrates, Find details about China Heat Sinks for High Power Electronics, High Power LED Substrate from Si3n4 Ceramic Substrate Manufacturer, Silicon Nitrides for IGBT, Power Module Substrates, LED Substrate, Heat Dissipation Substrates - Suzhou Hulsin Electronics And then, we paste the high power LED beads to the front of the substrate, testing and studying the heat dissipation influences of the AlN thin film on the high-power LED beads. Therefore, as an important component of LED, the packaging substrate is not only the role of the carrier, but also one of the important channels of heat Ceramic substrates are mainly used as hybrid IC substrates, thin film IC substrates, heat dissipation substrates, and LED sub-mount substrates. Keywords High-power LED array Microchannel heat sink Thermal resistance Analytical solution Optimized simulation Nomenclature l, w and z Heat sink length, width and height (m) l, w c and z c Channel length, width and height (m) w w Fin width (m) n Number of channels Try to ensure that the temperature of the heat sink does not exceed 60 ° C. the heat sourced by LED chips firstly radiate by the way of its metal piece, and then are delivered to the aluminum substrate via solder, next go through the thermal conduction glue to the aluminum radiators , finally dissipate into the air . 16 Apr 2018 The aluminum substrate is replaced with a LED-specific heat-dissipating white backlight ink coating. This study uses a synthetic graphite fiber as the heat dissipation substrate for top-emission organic light emitting diode (TEOLED) to reduce the impact from joule heat. A diamond coating-layer is studied as heat spreading layer for thin-GaN LED (Light Emitting Diode) chip. The thermal transient measurement was recorded for the given Light Emitting Diode (LED) attached with AlN and C-AlN thin ceramic substrate, so all the lead can be primary thermal path to carry heat away from the package. New Heat Spreader Solution Solders LEDs to Copper Substrate for 10x Improvement in Heat Dissipation : escatec, one of europe's leading providers of contract design and manufacturing services, will be launching its solution to the challenge of effectively cooling high brightness leds on its stand e8 at the led professional symposium 2015 in bregenz, austria on 22-24 september 2015. Ultra thermal stability of LED die-attach achieved by  Most power LED designs can use the following products: Aluminum-core Printed Circuit Boards (PCBs):. If yellowish backlight ink is specified, the  21 Apr 2015 PCB substrates designed for thermal management have been around The LED package emits light forward and any excess heat is designed to comes from FR -4 PTH PCBs using thermal vias to enhance heat dissipation. --More: 2010/05 [Articles] Tendency of protection component : 2010/04 [News] LEDinside -The new trend of dissipation-LED Heat Substrates--More: 2010/03 Mar 11, 2011 · Viking Tech steps into production of heat-dissipation ceramic substrates of HCPV (Jun 28, 2011) Harvatek to set up joint venture in China (Jun 27, 2011) Viking Tech ships LED heat sink substrates Heat Dissipation. com The heat dissipation of LED will have an important impact on the efficiency, life and reliability of LED chips, which requires that the packaging of LED has good heat dissipation capability. The light-emitting mechanism of LEDs is that the electrons in the PN junction transition between the energy bands to generate light energy, and the chip has a fever phenomenon, especially a high-power LED, which is assembled into a module using a plurality of LEDs, and the heat dissipation is With Mo-Cu R670, “PLANSEE High Performance Materials” has developed a new molybdenum-copper composite material for semiconductor wafer substrates. A change of concept CeramCool® Substrates – Most effi cient heat dissipation Multi-LED chips work with high power densities. Copper coverage dimension on PCB board can be extended beyond the solder pad in order to improve heat dissipation. TEOLED  9 Dec 2015 Effective Heat Dissipation from Color-Converting Plates in phosphor glass film printed on sapphire substrate for high-power white LEDs/LDs. The common cathode LED display screen is developed and manufactured by Ruiling Factory,it can save energy up to 75% and waterproof IP68,it is aluminum substrate which has perfect performance for heat-dissipation and anti-flaming. With its precision cut heat dissipation fins exposed, any heat that is produced is dissipated readily and efficiently. After assembly, it needs to be outside the heat dissipation module of the lamp, and it is protected by paint to prevent weather erosion. Solution-processed perovskite light-emitting diodes (LEDs) possess outstanding optoelectronic properties for potential solid-state display applications. May 18, 2011 · Viking Tech steps into production of heat-dissipation ceramic substrates of HCPV (Jun 28, 2011) Ta-I shipping LED heat sink substrates to Everlight, Delta (Jun 17, 2011) Management of heat dissipation in LED lighting device is critical for highest brightness and long-term performance. 2 – Led strips can be applied to different substrates and types of surfaces, the better a surface insulates, the less well the LED strips lose their heat. Heat dissipation of the Metallized Substrate(DPC) Heat generated by electronic circuitry must be dissipated to prevent immediate failure and improve long term reliability, therefore thermal management is critical. May 29, 2019 · For III‐nitride‐based devices, such as high‐brightness light‐emitting diodes (LEDs), the poor heat dissipation of the sapphire substrate is deleterious to the energy efficiency and restricts many of their applications. 70 µm & 105 µm) improve thermal dissipation properties and thus enable heat distribution over larger surfaces. In order to compare easily, some parts of the reverse of aluminum substrate should be overlaid thermally conductive silicone. When the thermal heat dissipation requirements of a design are very high, using an Aluminum backed PCB is a highly effective solution. An LED operating in an ambient environment at normal room temperature (between 20°C and 25°C) and at manufacturer-recommended currents can have much higher junction temperatures, such as 60°C to 80°C. Because aluminum has high thermal conductivity and good heat dissipation, it can effectively export internal heat. ・From a careful CFD simulation, an aluminum chassis and an aluminum radiation fin with a structure that has excellent exhaust heat was LED Al2O3 thick film substrate ; LED AlN thin film heat-dissipation substrate ; Flip chip substrate ; The integration of the thin film,thick film,electrode plating and electroless plating processes: Application: 1. Learn More Big LED Screen Installed on Wall LED lighting substrate of BLU; LED lighting substrate; MDPS, ECU substrate of Automotive; Power module; High reliability, DST-9000; High heat dissipation; Good adhesive strength to metal; Excellent thermal durability; LED lighting substrate ; MDPS, ECU substrate of Automotive; Power supply; High Tg & High thermal conductivity, DST-9000HT; High Because the aluminum material substrate of LED display has better heat conductivity and dissipation than plastic substrate. Since the NagaJo 1216 LED is small in package size, the heat density per area size is high, it is recommended to use MCPCB to surface mount this LED to enhance heat dissipation performance. chip-on-board multichip LED module copper-core MCPCB substrate with heat management solution as reported for ceramic substrates in [19], [20] and IMS [ 18] X. 2: Schematic diagram of a single-sided FR4 PCB Pure standard substrates without improvements such as FR4 are normally not -power LEDs due to 0. Most of the electricity in an LED becomes heat rather than light ( about 70% LED generates heat, the heat will first transfer through the top substrate to the  Heat dissipation is important in high-power LEDs and depends on the thermal conductivity of the substrate. In this document, the data that is deemed necessary in the detailed heat dissipation structure of the products and the heat dissipation design of the lighting apparatus is provided as a reference for the appropriate thermal design. Ceramic substrates are mainly used as hybrid IC substrates, thin film IC substrates, heat dissipation substrates, and LED sub-mount substrates. Metal core (also called IMS - Insulated Metal Substrate) PCBs are used to dissipate heat quickly and effectively from components. Now many manufacturers have formed an integrated LED street lamp head, and some of the materials used in the housing can also dissipate heat in one step. talk to an engineer about led assembly ADVANTAGES of CERAMIC-BASED LED assemblies Excellent heat dissipation Uniform heat transfer Conventional SMT processes possible Excellent LED die & substrate thermal coefficient… These insulating heat dissipation substrates combine a pattern circuit with some of the world's best ceramic materials for heat dissipation and strength. Aluminum substrate, good heat dissipation Energy saving, environmental protection, Stable performance, through strict test, Use safer driving in the car For most cars, just Plug-n-Play,no ballast required. It can also be said that if the heat conduction and heat dissipation problems are not solved during the design process, this product is a waste product! Moreover, the heat conduction problem is not solved, the heat sink is made. Ceramic Heat Dissipation—Less is more The heat sink becomes a module substrate that can be densely populated with LEDs and other components. High thermal conductivity and excellent electrical insulation are the two main properties of Aluminum Nitride ceramic. A numerical simulation model of the typical LED filament lamp was established to simulate and analyze the heat dissipation and airflow phenomenon of HT-5100M, a metal based substrate using the high thermal conducting epoxy resin, and MCF-5000I, a thin and flexible substrate with high heat dissipation ability and good workability, are applicable to LED lighting. LED LAMP; KA03 LED LAMP; KA04 LED LAMP; KA05 LED LAMP; > VIKING > Heat -Dissipation Ceramic Substrate: Download: General Specification and Process Capability LED heat dissipation has not been sufficient to cope with it. Structure of the High Heat Dissipation LED Array This section describes the structure of the high heat dissipation LED array. large  3PCS LED Backlight Strip High Brightness Aluminum Substrate Quick Heat Dissipation Lamp for 32" LG L-sale of low-price goods, in catalogue of products from  This is because the spectral output of LEDs for lighting does not contain infrared radiation, unlike incandescent lamps that produce a large amount of infrared (of  Management of heat dissipation in LED lighting device is critical for highest Thermal Interface Pad for LED Heat-Sink; Insulated Metal Thermal Substrate for  The thermal dissipation path of LEDs is different from other power electronic device counterparts. The service life of the LED street lamp aluminum substrate is usually 100,000 hours, with high thermal conductivity and low thermal resistance. Although LED lighting systems do not produce significant amounts of radiated heat, LEDs still generate heat within the junction, which must be dissipated by convection and conduction. However, most aluminum substrate insulation layers have little thermal conductivity or even thermal conductivity, so that heat cannot be conducted from the LEDs to the heat sink (metal substrate), and the entire heat dissipation channel cannot be unblocked. Good heat dissipation technology is the essential elements for stable running of LED and electronics related products the important factors affecting excellent heat resistance, it can be applied not only to LED but also to power modules and automobile circuit boards. In turn, the LED chip can actually be used for 50,000 hours and not shorten its life span and still maintain its temperature below 55∘C. A first plurality of LEDs is connected in a series on one side of a flat substrate and a second plurality of LEDs, equal in number to the first, is connected in series on an opposite side of the substrate. It means we need to increase the path of the LED pad to the base substrate to accelerate the heat emission from the base material. Abstract: In recent high power LED applications, metal core PCB (MCPCB) has replaced FR4 PCB in order to achieve greater heat dissipation ability. By employing the prepared 3DPC LEDs, KGS_4-based WLED module exhibits an excellent optical performance with a LE of 61. Present improvement in terms of thermal-conducting capability of PCBs lies in improvement through resin and filling adding but it only works within a limited category. The composite processings increase the adhesion strength, dimension accuracy and smoothness of circuit trace. The heat dissipation performance in a conventional chip on board (COB) LED module is limited by the very low thermal conductivity of the dielectric layer. Only in this way, LED lighting has a better In addition, for its excellent heat dissipation performance, sapphire wafer can be used as GaN Ideal substrate material for growth processes. Jun 28, 2019 · Selecting the copper substrate: the density is high, the substrate itself has strong heat carrying capacity, and the heat conduction and heat dissipation are good. Find Details about LED chip,ceramic substrate,ceramic metallization,ceramic DPC,ceramic DBC,thin film ceramic substrate,cree,rebal substrate from Taiwan LED supplier-TENSKY INTERNATIONAL CO. A highly thermally conductive insulated metal substrate (   2018年9月18日 Heat dissipation is important in high-power LEDs and depends on the thermal conductivity of the substrate. Copper coverage dimension on PCB board can be extended The common cathode LED display screen is developed and manufactured by Ruiling Factory,it can save energy up to 75% and waterproof IP68,it is aluminum substrate which has perfect performance for heat-dissipation and anti-flaming. The wall-plug efficiency (optical power out divided by electrical power in) of LED packages is typically in the region of 5-40%, meaning that somewhere between 60 and 95% of the input power is lost as heat. 02°Ccm 2 /W, the aluminium oxide’s thermal resistance makes it an excellent material for heat sinking, while its dielectric constant of 9. The LED aluminum substrate is in Print the circuit on the flat surface of aluminum with better mutation, and then solder the electronic components to it. Mar 15, 2020 · The 3DPC LED module incorporated with KGS_4 as the cavity displays excellent heat dissipation compared with the traditional PC LED module. Sep 29, 2018 · Comparison of thermal properties between ceramic substrate PCB and aluminum substrate MCPCB. 2020 popular 1 trends in Lights & Lighting, Lamp Radiators, LED Bulbs & Tubes, Computer & Office with Diy Led Heatsink and 1. When the LED lamp 100 is assembled, the two light modules 20 are attached to the bottom surface of the substrate 12 of the heat sink 10 and beside the three through-holes 18. IC substrates support critical functions including circuit support and protection, heat dissipation, and signal and power distribution. The temperature rising curves shown in the Figure 6 b indicated that the equilibrium of LED chip temperature with as-received, micro-grooved and micro-gridded were 64. Created Date: 1/29/2014 1:00:49 PM Find Details about PRODUCTS, aluminum heat sink, copper heat sink on MINGFA TECH MANUFACTURING LIMITED. With an applied external current, the heat will then be forced to flow to the bottom substrate through the thermoelectric units so that the temperature of the high power LED can be stable. Source ceramic metallize, thin film ceramic, Ceramic PCB, IGBT substrate, DPC, LED substrate on Taiwantrade. That reality makes heat dissipation a top priority for designers of lighting based around illumination-grade LEDs. ・LEDs, which have the characteristics of low power and longer life, are hghly expected as the lights of the next generation. talk to an engineer about led assembly ADVANTAGES of CERAMIC-BASED LED assemblies Excellent heat dissipation Uniform heat transfer Conventional SMT processes possible Excellent LED die & substrate thermal coefficient… Jan 05, 2017 · A COB LED module of 20x20mm for 20W or a COB LED module of 40x40mm for 20W can have a total different heat conduction towards the heat sink, So, that is why, some SMD LED down light keep 180mm of a high heat dissipation LED array in which the distance between the light-emitting area and thermal conductive substrate is approximately μm. Keywords: graphene oxide, light-emitting diodes, patterned sapphire substrate, heat dissipation, Key Features. Metal core pcb is abbreviated as MCPCB, it is made of  The heat dissipation device is disposed on the second surface. Heat dissipation behavior of top-emission OLEDs fabricated on silicon, glass, and planarized stainless steel substrates was measured by using an infrared camera. Optimized heat dissipation could effectively reduce heat accumulation in LED arrays and alleviate an increase in the junction temperature High Thermal Conductivity AlN Aluminum Nitride Ceramic Substrate/Sheet/Plate. com Aluminum Substrate with Superior Heat Dissipation SL Series Aluminum board excellent in thermal dissipation, an alternative to glass epoxy circuit boards. Since the p-type doping of III-nitride is limited by the solubility of the Mg acceptor and the higher activation energy of the holes, heat is particularly easily generated in the multiple p-type region, and this heat must be dissipated on the heat sink through the entire structure; The heat dissipation path of LED The LED modules also transmit only a small amount of heat to the substrate, enabling high quality processing even for heat sensitive substrates. Compared with conventional 2 W/m・K substrate, HT-5100M could lower the temperature of LED by 7 °C. The heat generated by the LED chip is transmitted to the heat sink through the aluminum substrate to form an excellent heat dissipation structure. Nov 30, 2019 · The stability and the lifetime of light emitting diodes (LEDs) are directly affected by the heat dissipation effect. 5 to 10 is on par with that of aluminium nitride, the expensive and hard to process ceramic substrate typically used in high power LED applications. This DCB and AMB Substrates for Power Modules is provided by using ceramic substrate made from material of aluminum oxides family, directly bonded by copper (Direct Copper Bonding = DCB), without joint layer which might generate thermal resistance. MARUBENI-OPTO™ has established a variety of materials to aid your project with the best in thermal management and the most cost-effective. This article mainly introduces the heat dissipation of Led lamps, because any LED will be made into lamps, so the heat generated by the LED wafers will always be dissipated into the air through the outer casing of the lamps. LED was based on   Exploring LED Light Illumination Problem from Heat Dissipation Technology in the design of the heat sink substrate fins and the heat dissipation module. 4 Results for "Heat dissipation" Alumina Substrates; Thick-Film Printed Substrates with Thinner Thickness one; Alumina Substrates for LED with High Reflectivity; AlN and Carbon-doped AlN (C-AlN) thin films were grown on metal substrates (Cu and Al) and heat sink by RF coupled DC sputtering. These boards Alumina Ceramic Heat Dissipation Insulator Substrate Alumina Ceramic is the material used in a wide variety of industrial and engineering applications for its high performance and purity. 22 Jun 2009 (Color online) J-V-L characteristics of TEOLEDs (schematic de- scription of the TEOLED structure is included in inset). In fabricating LEDs, single crystal and lampshade together form the whole heat dissipation structure of LED lamp. Jun 22, 2009 · We report substrate thermal conductivity effect on heat dissipation and lifetime improvement of organic light-emitting diodes (OLEDs). However, poor device stability results in significant efficiency droop partly being ascribed to Joule heating when LEDs are operated at high current densities. -thick dielectric to improve isolation between the copper circuit Primary condition of PCB performing well in heat resistance and dissipation is the heat resistance and dissipation capacity of substrate. For the low power uv-led light power is small, the heat is not big, the heat dissipation problem appears to be insignificant, and for the high power uv-led package, in order to improve the light intensity, generally need to adopt the way of array module. 46ft) High heat resistance: LED lightings: Plastic Molding Compounds for LED "FULL BRIGHT" High reflectance: Circuit board materials for LED "ECOOL series" High heat dissipation: IC package: Circuit board materials for IC substrate "MEGTRON GX series" Low warpage "Semiconductor Encapsulation Materials", "Liquid Encapsulant" High heat resistance High For Canadian customers this can be purchased domestically using CAD by visiting our Canadian site. 1 Nov 2006 This differentiates LEDs from other lighting sources where most heat is W dissipation, but above that some metallic substrates are required. Heat Dissipation Design Dec 20, 2012 · The LED illuminator of claim 10, wherein another surface of the heat-conducting substrate is connected to a plurality of heat-dissipating columns, and a containing area for containing the LED illuminating module is formed between the heat-dissipating columns on that surface of the heat-conducting substrate. Growing GaN on a sapphire substrate is easy to obtain large-size epitaxial wafers, and the price is relatively cheap. It dissipation of heat is of major importance in order to keep the junction In the case of LED packages based on ceramic substrates, the semiconductor. Shop the top 25 most popular 1 at the best prices! Feb 20, 2020 · Commonly manufacturers recommend not to exceed 85 C on LED substrate. These LEDs  Improving the thermal conductivity by reducing the heat dissipation path between LED chip and substrate in YUJILEDS flip chip packaging technology result in  LED-modules to produce white light with a defined quality. 2V / 3 Watt) SMD COB Light Emitter Components Diode 3 W The heat dissipation problem of LED is the most troublesome problem for LED manufacturers, but aluminum substrate can be used, because aluminum has high thermal conductivity and good heat dissipation, which can effectively export internal heat. 3 W•cm-1• k-1, both of which are far lower than the thermal conductivity of silicon carbide crystal. The basics of LED cooling and LED heat sinks let me add: LED's aluminum heat sink isn't radiating heat; heat dissipation works here via way the heat dissipates in an LED module mounted on a heat-sinking substrate. In their work, the heat dissipation of high power LED was enhanced by a loop heat pipe cooling system. In this study, an enhanced model is proposed to achieve effective heat dissipation using an aluminum nitride (AlN) insulation plate instead of the dielectric layer. Because LED lighting is more powerful than household lamps, manufacturers have painstakingly designed the heat sink substrate fins and heat dissipation modules. One of the key issues when designing more compact and high-performance electronic devices is "how much heat produced from chips can be dissipated". 2: according to the relevant design criteria of radiator, the tooth thickness, tooth shape, tooth spacing and substrate thickness of radiator are optimized. ・For higher performance of LED, we developed Alumina Substrates with high brightness and high reflectivity. Electroplating can be then used to increase the thickness of circuit cued increase the capability of heat dissipation. Since the LED panel light cannot be cooled by a fan or a natural convection heat dissipation method, the LED heat dissipation design must also meet the optical requirements of the LED lighting fixture. This would improve heat dissipation and keeping the temperature as well as the junction temperature of LEDs in safe operating conditions and make the MgO/ZnO multilayer thin film as a reliable heat spreader material in thermal management application. AlN substrates are typically used in heat dissipation substrate, LED package, power module, wafer bonding, power resistor The heat dissipation is designed first, and then the shape is designed. Modern ceramic LED lamps of the same size are available in a range of wattages, brightness and other performance characteristics. However, the heat generated by the LED chips is traditionally dissipated by relying on the natural convection within lamps, resulting in poor heat dissipation performance for LED filament lamps. The thermal conductivity of single-crystal LGO was measured utilizing the 3/spl omega/ technique for temperatures ranging from 100 K-500 K. With ceramic it is feasible that the cooling dissipation materials in order to evaluate the compatibility of all materials before use. of Design - Europe, Altair Engineering GmbH LEDs suffer heat problems limiting their success as a light source. Metal core PCBs are often chosen for LED applications because they have enhanced heat dissipation capabilities. The plastic conductive coefficient is about 1/500-1/6000 of metal, the conductive coefficient of aluminum is about 3 times of metal. The first element is the LED package from the junction (j) to the solder point (sp) on the supporting substrate (R th j-sp). China Heat Dissipation manufacturers - Select 2020 high quality Heat Dissipation products in best price from certified Chinese Heat Sink manufacturers, Heat Preservation suppliers, wholesalers and factory on Made-in-China. if the heat dissipation design of led street light is not so good and when the temperature of led is too high, the lighting decay will be in a very fast pace. Disadvantage: Because of the reliability and stability of the micro-pump, the system has a great influence on it, and the structure of the system is more complicated and the operating cost is increased. Why does i-save LED lamps bring so much power by using less energy? The answer is relativly simple but surprising. AlN substrates are typically used in heat dissipation substrate, LED package, power module, wafer bonding, power resistor Current aluminum substrates for LED street lamps are 150W, 80W, 72W, 36W, 12W, 14W, etc. RGB-LED   For the heat dissipation study and thermal analysis of LED module are used the ceramic substrate, which is computed using (3) below. Oct 30, 2013 · The packages were subjected to wet and high temperature operation life (WHTOL) and thermal shock tests. This led to development of new packaging materials including the sub-mounts/substrates, circuit boards and materials used Heat dissipation is an inevitable subject during the design of light emitting diode (LED) lighting, especially for museums and medical equipment. 15 / piece Free Shipping (33) | 54 Orders heat dissipation effect, and the minimum of thermal resis-tance is 0. (1) The non-uniform junction temperature of the module across the LED arrays and the uneven Ceramic Heat Dissipation—Less is more The heat sink becomes a module substrate that can be densely populated with LEDs and other components. Samsung uses its practical experience with heat dissipation technology to  LED chip cooling mainly the selection process with the substrate and the circuit, since the city made any LED lamps, so the heat generated by the LED chip by  Kyocera's low-thermal resistance ceramic substrate improves heat dissipation and allows high density mounting of LED chips. 1W 3W 5W LED Heat Sink Aluminum Base Plate PCB Board Substrate 20mm Star RGB RGBW DIY Cooling for 1 3 5 W Watt LED US $3. Even though the substrate and lampshade contribute little effective heat transfer area, they are crucial for forming a beneficial flow pattern to heat transfer. Oct 30, 2013 · The simulation was carried out with two 3D LED package model designed with varied copper rectangular heat slug size, R1 and R2 where R1 and R2 is acronym denotes the heat slug with varied size of The basic structure of the 3D LED package comprises of single GaN LED chip with dimension of l=1, w=1, h=0. In the current work, we significantly improved the heat-dissipation characteristics of an InGaN/GaN quantum-well (QW) green LED by using hexagonal boron nitride (hBN The heat dissipation of the LED was based on rated wall-plug efficiency — the energy conversion efficiency with which the system converts electrical power into optical power. Favorable heat dissipation effects can increase the life time and enhance the efficiency of LEDs, while poor heat dissipation will raise the temperature, reduce the efficiency of light emission and reduce the lifetime of the LED. In the most commonly used process for the production of blue spectrum chips - including white LEDs - gallium nitride-based semiconductor layers (GaN) are grown on sapphire substrate (Al2O3) using epitaxial growth methods like MOCVD. Since they are light in weight, the aluminum core PCBs find their purpose in LED lighting, audio frequency apparatus, and communication electronic equipment. CooLam™ thermal substrates were developed for use in submount, chip-on-board, and metal core PCB LED packaging applications. Feb 05, 2013 · For conventional LED on sapphire, when the chip is mounted on a heat-sink, most of the heat flows from the active region through n-type cladding layer and the sapphire substrate to the heat-sink Specifically, the heat generated by the LED chip from its metal heat block out, go through the solder to the aluminum substrate PCB, through the thermally conductive glue only to the aluminum radiator. Generally, the lamp bead is welded on the aluminum substrate, and the aluminum substrate is connected with the radiator. Therefore, the LED packaging and assembly industry had to find creative ways to find a low resistance heat conduction path from LED to ambient. The coming out of ceramic substrates opens the new development of the thermal application industry, thanks to their characteristics, such as high heat dissipation, low thermal Jan 28, 2020 · Thermal Management Is A Major Issue In High-Brightness LED Applications . Solar Cell Printed Circuit Design For Enhance Heat Dissipation For NagaJo package, the base substrate is built with Aluminum Nitride of 170W/mk thermal conductivity, so all the lead can be primary thermal path to carry heat away from the package. Dec 07, 2012 · Because of SiC substrate good conductive properties and thermal conductivity, which can solve power type GaNLED device heat dissipation problems, therefore, in the semiconductor lighting technology, which occupies an important position. In addition to providing the physical, structural base of the LED strip, the substrate also provides electricity supply through its circuitry, as well as a vital path for heat dissipation. So the substrate temperature T LED was used as parameter for estimating the heat dissipation performance of cooling system. By performing a metallographic cross-sectional analysis of a burned-out LED still soldered to the IMS substrate, we observed that the dielectric layer in the substrate had separated from the aluminium, preventing heat transmission from the LED to the substrate. led heat dissipation substrate

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